The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.
Flip Chip - EEE Parts Database
Thermal Stresses in a Flip-Chip Design, Background/Incentive
Packaging concept with a mmw flip chip interconnect and a
Practical Dummy Components Daisy Chain Dummy Components
Advanced Flip Chip Packaging
Practical Dummy Components Daisy Chain Dummy Components
Development of Flip Chip Bonding Process on Silicon Interposer by
Flip-Chip
a) A typical flip-chip, CBGA package with heat sink (adapted from