Flip Chip Dummy Component

Description

The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.

Flip Chip - EEE Parts Database

Thermal Stresses in a Flip-Chip Design, Background/Incentive

Packaging concept with a mmw flip chip interconnect and a

Practical Dummy Components Daisy Chain Dummy Components

Advanced Flip Chip Packaging

Practical Dummy Components Daisy Chain Dummy Components

Development of Flip Chip Bonding Process on Silicon Interposer by

Flip-Chip

a) A typical flip-chip, CBGA package with heat sink (adapted from

$ 31.50USD
Score 4.7(549)
In stock
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